Japan tanaka precious metals industry corporation and S.E.I company announced on April 4, 2016, with gold particles "AuRoFUSE" joint material at low temperature, developed to meet the requirements of high output power of the LED module.when the lights are under the influence of the heat generated by the power output will decline, therefore, problems of how to improve the heat dissipation LED module.This new product to solve the problem.

Specific approach is to use AuRoFUSE as a bonding material for flip chip bonding, rather than the current mainstream way - wire bonding.Flip chip bonding is the use of protruding terminal (bump) connected to the lead frame in electric circuit and the substrate, the method of directly to the LED chip bonding to the substrate, shiny surface as a heat source close to the substrate, so easy to make the heat dissipation.In addition, by removing the fuse and saves not only lead to take up space, realize the miniaturization, but also can improve the electrical characteristics.

However, in the past in the flip chip bonding, right must be use expensive aluminum nitride substrate.This is because the cheap metal substrate and the thermal expansion coefficient of the LED chip existence very big difference, joint easy to damage.In the technology, as the joint material AuRoFUSE containing gold particles, the gold particles can be moderate thermal expansion deformation, thus can use cheaper metal substrate.With this technology, can achieve high power output of the LED module and miniaturization.

Tanaka precious metals will be in April 6, 2016 in Tokyo have Ming international convention and exhibition centre on metal "exhibition" Japan the 3rd high function, through the company's booth on the LED module.Is the company goals for the future, the use of the LED module will be available to import and export of frozen warehouse and can use the advantages of miniaturization of automotive lighting, etc.